Wafer polishing

■ PNX200L

■ SPP600S

■ SPP800ATB

PNX200L

■ Dry in/ wet out cassette stage

■ Able to measure wafer thickness before and after polishing

■ Both brush and diamond conditioning is available

SPP800ATB

■ Wax less batch process

   - 4inch x 8 wafers

   - 5inch x 5 wafers

   - 6inch x 4 wafers

■ High productivity

   - 2 polishing table and 3 index polish head

   - Dedicated load / un-load station

   - Dry-in / wet out process

10um Removal 
8 Wafer / 7 Min
(≒68.5 wafers /H)

5um Removal
8 Wafer / 5 Min
(≒96wafers /H)